Through-Silicon Vias for 3D Integration 1st Edition
Kindle Edition or EPUB + Converted PDF نویسندگان: John H. Lau
جزئیات
فرمت: Kindle Edition or EPUB + Converted PDF ناشر: McGraw Hill; 1st edition (August 5, 2012) تاریخ انتشار نسخه الکترونیکی : August 5, 2012
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شابک: 9780071785143 لینک: https://www.amazon.com/Through-Silicon-Vias-Integration-John-Lau-ebook/dp/B008SOCEMW
2,399,000 تومان
زمان تحویل: حداکثر 24 ساعت
توضیحات
A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.Coverage includes:Nanotechnology and 3D integration for the semiconductor industryTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealingTSVs: mechanical, thermal, and electrical behaviorsThin-wafer strength measurementWafer thinning and thin-wafer handlingMicrobumping, assembly, and reliabilityMicrobump electromigrationTransient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposersThermal management of 3D IC integration3D IC packaging
2,399,000 تومان
زمان تحویل: حداکثر 24 ساعت